Working Time: 9:30-18:00
2025 The 10th International Conference on Integrated Circuits and Microsystems
    Email: icicm_conf@vip.163.com
    Secretary: Ms. Mila Xiao(肖老师)

KEYNOTE SPEAKERS 主旨报告专家

Prof. Xue Quan, IEEE Fellow
South China University of Technology, China

薛泉,华南理工大学电子学院院长,IEEE 会士

Prof. Xue Quan is currently Dean of the School of Microelectronics at South China University of Technology. He is an IEEE Fellow, China Overseas High-Level Talent, Member of the National 6G Technology R&D General Expert Group, IEEE MTT-S Fellow Evaluating Committee Member, IEEE Distinguished Microwave Lecturer, and Director of Guangdong Provincial Key Laboratory of Millimeter-Wave and Terahertz. His research fields include microwave, millimeter-wave, and terahertz integrated circuits (IC), circuits, antennas, packages, and systems. He is the principal investigator of over 20 major research programs, including the National Key Research and Development Program and Key-Area Research and Development Program of Guangdong Province. He has published over 400 SCI-indexed papers and received over 13,000 citations (Scopus, excluding self-citation). He was granted over 20 China patents and about 30 US patents (5 assigned to US companies). Awards include the second prize of the National Technology Invention Award, first prize of the Guangdong Science and Technology Award, and the IEEE AP-S 2017 Harold A. Wheeler Applications Prize Paper Award.

Prof. Cheng Zhuo, IET Fellow
Zhejiang University, China

卓成,浙江大学集成电路学院副院长,IET 会士

Prof. Cheng Zhuo is a Qiushe Distinguished Professor, Tenured Professor, and Ph.D. supervisor at Zhejiang University. He has served as Deputy Director of the Advanced IC Manufacturing Technology Research Institute, Director of the Institute of Computational Intelligence and Signal Processing, Deputy Director of the Graduate Admissions Office, and Director of Zhejiang University-Youpaiyun Intelligent Computing Innovation Joint Research Center. He is a National High-Level Science and Technology Innovation Talent, Zhejiang Provincial Distinguished Expert, IEEE CEDA Distinguished Lecturer (the first mainland China scholar), and IET Fellow. Prof. Zhuo obtained his Bachelor and Master degrees from Zhejiang University and his Ph.D. from the University of Michigan, Ann Arbor. He has been a visiting professor at University of Notre Dame and Osaka University. He serves as an editor for IEEE TCAD, ACM TODAES, Elsevier Integration, and other international journals, and has chaired multiple international IC conferences and technical committees. He leads over ten national and provincial research projects and has published more than 200 internationally recognized papers and 3 book chapters in journals and conferences such as Nature Communications, IEEE TC, IEEE TCAD, IEEE EDL, DAC, and IEDM. He has won multiple awards including best paper awards at DAC and ICCAD, ACM SIGDA Technical Leadership and Service Awards, and Zhejiang University academic innovation awards. His research focuses on IC design and EDA, including design-manufacturing co-optimization, low-power circuits and systems, deep learning algorithm hardware acceleration, and power/signal integrity.

Prof. Le Ye
Peking University, China

叶乐,北京大学,国家杰青、优青

Prof. Le Ye is a Ph.D. supervisor at the School of Integrated Circuits, Peking University, selected as a National Outstanding Youth and Excellent Young Scientist, and Deputy Director of the Zhejiang Peking University Institute of Information Technology and Director of the IoT Center. He teaches undergraduate and graduate courses and summer programs. As project leader, he undertakes major national and provincial research projects, including the 13th Five-Year National Key R&D Program, National Natural Science Foundation “Post-Moore Major Research Plan,” and Zhejiang Province Key R&D Program. His research focuses on ultra-low-power/high-efficiency chip design, AIoT chips, in-memory AI chips, and analog/mixed-signal chips. He has published over 70 papers in ISSCC, JSSC, TCAS-I, EDL, IMS, ESSCIRC, A-SSCC, ISCAS, etc. Two ISSCC papers were selected as Highlight papers. He received the ISSCC 2021 Best Chip Demonstration Award, China Semiconductor Top 10 Research Progress 2021, and holds over 40 invention patents. He serves as AE for IEEE TCAS-I, editorial board member for domestic journals, and participates in national key expert groups in microelectronics and AI standards.


INVITED SPEAKERS 特邀报告专家

Prof. Yun Li
Nanjing University, China

Dr. Yun Li is now working as a full professor in the school of electronic science and engineering, Nanjing University. He obtained his bachelor and doctor degrees in Nanjing University, and then worked as a postdoctoral researcher in the national institute for materials science (NIMS) in Japan. His research interests are innovative and advanced organic optoelectronic devices using ultrathin organic semiconducting crystals via fabrications through the use of novel materials and device architectures as well as advanced techniques. He has published more than 110 papers with over 5000 citations, and achieved the Distinguished Lectureship Award from the Chemistry Society of Japan in 2018. In recent years, he was dedicated to exploring of the intrinsic charge transport behaviors in organic semiconductors, developing of organic neuromorphic computing devices, and structuring retina-inspired artificial vision systems.

 

Assoc.Prof. Sha Xu
Guangdong University of Technology, China

Dr. Sha Xu is an associate professor in the School of Integrated Circuits, Guangdong University of Technology, China. She received her B.E. degree in Electronic Science and Technology from Huazhong University of Science and Technology in 2010 and her Ph.D. degree in Electronic Engineering from City University of Hong Kong in 2014. From 2014 to 2018, Dr. Xu was a Senior Engineer at the Advanced Electronic Components and Systems Division of the Hong Kong Applied Science and Technology Research Institute (ASTRI), where she led multiple industry-oriented R&D projects. In 2018, she joined Guangdong University of Technology.
Her research interests focus on heterogeneous integration, 3-D advanced packaging, antenna-in-package (AiP), and analog integrated-circuit design. She has served as Principal Investigator for one General Program and one Key Program sub-project funded by the National Natural Science Foundation of China (NSFC), three provincial-level projects, and five industry-funded projects. She is also a key participant in two National Key R&D projects. Xu has authored or co-authored more than fifty peer-reviewed journal and conference papers and holds ten granted invention patents, five of which have been successfully licensed or transferred to industry, including two U.S. patents.

 

Assoc.Prof. Hongmei Chen
Hefei University of Technology, China

Dr. Hongmei Chen is an Associate Professor and Master’s Supervisor at the School of Microelectronics, Hefei University of Technology, China. She received her Ph.D. in Engineering with a specialization in Circuits and Systems from the University of Science and Technology of China (USTC) in 2017. Her research focuses on mixed-signal integrated circuit (IC) design, including analog-to-digital/digital-to-analog converters (ADC/DAC), sensor signal conditioning chips, and power management ICs.
As a principal investigator, she has led research projects funded by the Equipment Development Department of China and contributed to multiple national-level programs, such as the "11th/12th Five-Year" Pre-research Projects, NSFC General Program, and key sub-projects of the National Key R&D Program. She also maintains close collaborations with leading Chinese enterprises, including CETC 24th & 38th Research Institutes and Wuxi Icore Electronics Ltd., co-developing several high-performance ICs.
Dr. Chen has published over 30 peer-reviewed papers, including 10+ SCI-indexed articles, and holds multiple invention patents (5 granted).

 

Assoc.Prof. Haoshen Zhu,
South China University of Technology, China

Haoshen Zhu received the B.E. degree in electrical engineering from the Wuhan University of Technology, Wuhan, China, in 2009, and the Ph.D. degree in electronics engineering from the City University of Hong Kong, Hong Kong, in 2015. In 2015, he joined RDA Microelectronics, Shanghai, China, as a Senior MEMS Design Engineer. From 2015 to 2017, he was a Research Fellow with the University of Michigan, Ann Arbor, MI, USA, and then a Caltech Post-doctoral Scholar with the NASA Jet Propulsion Laboratory, Pasadena, CA, USA. He is currently a Professor with the School of Electronics and Information Engineering, South China University of Technology, Guangzhou, China. His research interests include RF MEMS devices (i.e. SAW/BAW resonators and filters), RF front-end ICs and advanced integration technologies for RF microsystems. He has published over 150 papers in peer-reviewed journals and conferences. He holds more than 20 granted Chinese patents.He is a member of MTT-S Working Group on China Strategy and Membership, the regional coordinator for Region 10 (China) in YP committee. He is included in the editorial board for International Journal of Microwave and Wireless Technology. He served as TPC Co-chair of IMWS-AMP 2022 and organizing committee member in several MTT-S international conferences, i.e. IWS.