Working Time: 9:30-18:00
2024 The 9th International Conference on Integrated Circuits and Microsystems
    Email: icicm_conf@vip.163.com

Topics
(related to the below topics, but not only limited)
  • Track 1: Electronic Design Automation (EDA)
    • Progress of EDA algorithms
    • EDA for emerging technologies
    • Hardware-software co-design with EDA
    • EDA in High Performance Computing (HPC)
    • EDA in analog and mixed-signal design
    • Security and reliability in EDA
    • Open Source EDA Initiative
    • EDA and Internet of Things (IoT)
    • EDA for FPGA and ASIC design
    • EDA in the automotive industry

    Track 2: Integrated Circuit and System Design
    • Digital, analog, mixed-signal IC and SOC design technology
    • IC computer-aided design technology, DFM
    • Modeling and simulation

    Track 3: Semiconductor Devices and Circuits
    • Components and circuits for wireless systems
    • Low power, RF devices and circuits
    • Silicon/Germanium Devices and Device Physics
    • Compound semiconductor devices and circuits
    • Non-traditional and nanoelectronics
    • Organic semiconductor devices and technologies
    • Photonics and optoelectronics

    Track 4: Process Technology and Manufacturing
    • Silicon integrated circuits and manufacturing
    • Interconnect, low-K, high-K and other process technologies
    • Packaging and testing technology, equipment technology
    • 3D integration and advanced packaging
    • Chiplet technology

    Track 5: Microelectromechanical systems (MEMS) and sensors
    • THz and microwave microsystems
    • Displays, sensors and MEMS
    • Energy harvesting and wireless sensors
    • BioMEMS and biomedical sensors

    Track 6: Intelligent System Design
    • Software and hardware co-design
    • AI digital and analog software and hardware optimization
    • System-on-chip multi-objective optimization
    • GPU, TPU, DPU and dedicated AI accelerator space design optimization

    Track 7: Energy sources and storage
    • Solar cells and other new energy equipment
    • Advanced storage technologies (Flash, FeRAM, PCM, ReRAM, MRAM, etc.)
    • Batteries and energy storage systems

    Track 8: Applications and other topics
    • Communications ASICs and systems
    • Artificial Intelligence and Machine Learning in IC and System Design
    • Quantum computing and quantum electronics

  • Track 9: IC for Security and Security for IC
    • Hardware-intrinsic security primitives (e.g., PUF, TRNG, and PQC/FHE/NTT)
    • Architectural and microarchitectural attacks and defenses
    • Secure system-on-chip (SoC) architecture
    • Trusted platform modules and hardware virtualization
    • Side-channel attacks and countermeasures
    • Hardware IP core protection and trust for consumer electronics systems and IoT
    • Security and trust of AI/ML, and AI/ML for hardware security
    • Hardware-assisted cross-layer security
    • Emerging nanoscale technologies in hardware security applications



Track 1: 电子设计自动化(EDA)
• EDA算法的进展
• 适用于新兴技术的EDA
• 与EDA的硬件-软件协同设计
• 高性能计算(HPC)中的EDA
• 模拟和混合信号设计中的EDA
• EDA中的安全性和可靠性
• 开源EDA倡议
• EDA和物联网(IoT)
• 适用于FPGA和ASIC设计的EDA
• 汽车行业中的EDA

Track 2: 集成电路和系统设计
• 数字、模拟、混合信号IC和SOC设计技术
• IC计算机辅助设计技术、DFM
• 建模和仿真

Track 3: 半导体器件和电路
• 无线系统的器件和电路
• 低功耗、射频器件和电路
• 硅/锗器件和器件物理
• 复合半导体器件和电路
• 非传统和纳米电子学
• 有机半导体器件和技术
• 光子学和光电子学

Track 4: 工艺技术和制造
• 硅集成电路和制造
• 互连、低K、高K和其他工艺技术
• 封装和测试技术、设备技术
• 3D集成和先进封装
• Chiplet技术

Track 5: 微机电系统(MEMS)和传感器
• THz和微波微系统
• 显示器、传感器和MEMS
• 能量收集和无线传感器
• 生物MEMS和生物医学传感器

Track 6: 智能系统设计
• 软硬件协同设计
• AI数字、模拟软硬件优化
• 片上系统多目标优化
• GPU,TPU、DPU和专用AI加速器空间设计优化

Track 7: 能源来源和储存
• 太阳能电池和其他新能源设备
• 先进的存储技术(Flash、FeRAM、PCM、ReRAM、MRAM等)
• 电池和能量储存系统

Track 8: 应用和其他主题
• 通信ASIC和系统
• IC和系统设计中的人工智能和机器学习
• 量子计算和量子电子学

Track 9: 集成电路的安全和安全的集成电路
• 硬件内在的安全原语(例如,PUF(物理不可克隆函数)、TRNG(真随机数生成器)、PQC/FHE/NTT(后量子密码学/全同态加密/数论变换))
• 架构和微架构攻击与防御
• 安全片上系统(SoC)架构
• 可信平台模块和硬件虚拟化
• 侧信道攻击及对策
• 消费电子系统和物联网硬件IP核的保护和信任
• AI/ML(人工智能/机器学习)的安全和信任,以及AI/ML在硬件安全中的应用
• 硬件辅助的跨层安全
• 硬件安全应用中的新兴纳米级技术




 

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