Topics (related to the below topics, but not only limited)
Track 1: Electronic Design Automation (EDA) • Progress of EDA algorithms • EDA for emerging technologies • Hardware-software co-design with EDA • EDA in High Performance Computing (HPC) • EDA in analog and mixed-signal design • Security and reliability in EDA • Open Source EDA Initiative • EDA and Internet of Things (IoT) • EDA for FPGA and ASIC design • EDA in the automotive industry Track 2: Integrated Circuit and System Design • Digital, analog, mixed-signal IC and SOC design technology • IC computer-aided design technology, DFM • Modeling and simulation Track 3: Semiconductor Devices and Circuits • Components and circuits for wireless systems • Low power, RF devices and circuits • Silicon/Germanium Devices and Device Physics • Compound semiconductor devices and circuits • Non-traditional and nanoelectronics • Organic semiconductor devices and technologies • Photonics and optoelectronics Track 4: Process Technology and Manufacturing • Silicon integrated circuits and manufacturing • Interconnect, low-K, high-K and other process technologies • Packaging and testing technology, equipment technology • 3D integration and advanced packaging • Chiplet technology Track 5: Microelectromechanical systems (MEMS) and sensors • THz and microwave microsystems • Displays, sensors and MEMS • Energy harvesting and wireless sensors • BioMEMS and biomedical sensors Track 6: Intelligent System Design • Software and hardware co-design • AI digital and analog software and hardware optimization • System-on-chip multi-objective optimization • GPU, TPU, DPU and dedicated AI accelerator space design optimization Track 7: Energy sources and storage • Solar cells and other new energy equipment • Advanced storage technologies (Flash, FeRAM, PCM, ReRAM, MRAM, etc.) • Batteries and energy storage systems Track 8: Applications and other topics • Communications ASICs and systems • Artificial Intelligence and Machine Learning in IC and System Design • Quantum computing and quantum electronics Track 9: IC for Security and Security for IC • Hardware-intrinsic security primitives (e.g., PUF, TRNG, and PQC/FHE/NTT) • Architectural and microarchitectural attacks and defenses • Secure system-on-chip (SoC) architecture • Trusted platform modules and hardware virtualization • Side-channel attacks and countermeasures • Hardware IP core protection and trust for consumer electronics systems and IoT • Security and trust of AI/ML, and AI/ML for hardware security • Hardware-assisted cross-layer security • Emerging nanoscale technologies in hardware security applications	Track 1: 电子设计自动化（EDA） • EDA算法的进展 • 适用于新兴技术的EDA • 与EDA的硬件-软件协同设计 • 高性能计算（HPC）中的EDA • 模拟和混合信号设计中的EDA • EDA中的安全性和可靠性 • 开源EDA倡议 • EDA和物联网（IoT） • 适用于FPGA和ASIC设计的EDA • 汽车行业中的EDA Track 2: 集成电路和系统设计 • 数字、模拟、混合信号IC和SOC设计技术 • IC计算机辅助设计技术、DFM • 建模和仿真 Track 3: 半导体器件和电路 • 无线系统的器件和电路 • 低功耗、射频器件和电路 • 硅/锗器件和器件物理 • 复合半导体器件和电路 • 非传统和纳米电子学 • 有机半导体器件和技术 • 光子学和光电子学 Track 4: 工艺技术和制造 • 硅集成电路和制造 • 互连、低K、高K和其他工艺技术 • 封装和测试技术、设备技术 • 3D集成和先进封装 • Chiplet技术 Track 5: 微机电系统（MEMS）和传感器 • THz和微波微系统 • 显示器、传感器和MEMS • 能量收集和无线传感器 • 生物MEMS和生物医学传感器 Track 6: 智能系统设计 • 软硬件协同设计 • AI数字、模拟软硬件优化 • 片上系统多目标优化 • GPU，TPU、DPU和专用AI加速器空间设计优化 Track 7: 能源来源和储存 • 太阳能电池和其他新能源设备 • 先进的存储技术（Flash、FeRAM、PCM、ReRAM、MRAM等） • 电池和能量储存系统 Track 8: 应用和其他主题 • 通信ASIC和系统 • IC和系统设计中的人工智能和机器学习 • 量子计算和量子电子学 Track 9: 集成电路的安全和安全的集成电路 • 硬件内在的安全原语（例如，PUF（物理不可克隆函数）、TRNG（真随机数生成器）、PQC/FHE/NTT（后量子密码学/全同态加密/数论变换）） • 架构和微架构攻击与防御 • 安全片上系统（SoC）架构 • 可信平台模块和硬件虚拟化 • 侧信道攻击及对策 • 消费电子系统和物联网硬件IP核的保护和信任 • AI/ML（人工智能/机器学习）的安全和信任，以及AI/ML在硬件安全中的应用 • 硬件辅助的跨层安全 • 硬件安全应用中的新兴纳米级技术
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