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Topics (related to the below topics, but not only limited)
- Track 1: Electronic Design Automation (EDA)
- Progress of EDA algorithms
- EDA for emerging technologies
- Hardware-software co-design with EDA
- EDA in High Performance Computing (HPC)
- EDA in analog and mixed-signal design
- Security and reliability in EDA
- Open Source EDA Initiative
- EDA and Internet of Things (IoT)
- EDA for FPGA and ASIC design
- EDA in the automotive industry
- Track 2: Integrated Circuit and System Design
- Digital, analog, mixed-signal IC and SOC design technology
- IC computer-aided design technology, DFM
- Modeling and simulation
- Track 3: Semiconductor Devices and Circuits
- Components and circuits for wireless systems
- Low power, RF devices and circuits
- Silicon/Germanium Devices and Device Physics
- Compound semiconductor devices and circuits
- Non-traditional and nanoelectronics
- Organic semiconductor devices and technologies
- Photonics and optoelectronics
- Track 4: Process Technology and Manufacturing
- Silicon integrated circuits and manufacturing
- Interconnect, low-K, high-K and other process technologies
- Packaging and testing technology, equipment technology
- 3D integration and advanced packaging
- Chiplet technology
- Track 5: Microelectromechanical systems (MEMS) and sensors
- THz and microwave microsystems
- Displays, sensors and MEMS
- Energy harvesting and wireless sensors
- BioMEMS and biomedical sensors
- Track 6: Intelligent System Design
- Software and hardware co-design
- AI digital and analog software and hardware optimization
- System-on-chip multi-objective optimization
- GPU, TPU, DPU and dedicated AI accelerator space design optimization
- Track 7: Energy sources and storage
- Solar cells and other new energy equipment
- Advanced storage technologies (Flash, FeRAM, PCM, ReRAM, MRAM, etc.)
- Batteries and energy storage systems
- Track 8: Applications and other topics
- Communications ASICs and systems
- Artificial Intelligence and Machine Learning in IC and System Design
- Quantum computing and quantum electronics
- Track 9: IC for Security and Security for IC
- Hardware-intrinsic security primitives (e.g., PUF, TRNG, PQC/FHE/NTT)
- Architectural and microarchitectural attacks and defenses
- Secure system-on-chip (SoC) architecture
- Trusted platform modules and hardware virtualization
- Side-channel attacks and countermeasures
- Hardware IP core protection and trust for consumer electronics systems and IoT
- Security and trust of AI/ML, and AI/ML for hardware security
- Hardware-assisted cross-layer security
- Emerging nanoscale technologies in hardware security applications
主题（包括但不限于以下方向）
- Track 1: 电子设计自动化（EDA）
- EDA算法的进展
- 适用于新兴技术的EDA
- 与EDA的硬件-软件协同设计
- 高性能计算（HPC）中的EDA
- 模拟和混合信号设计中的EDA
- EDA中的安全性和可靠性
- 开源EDA倡议
- EDA和物联网（IoT）
- 适用于FPGA和ASIC设计的EDA
- 汽车行业中的EDA
- Track 2: 集成电路和系统设计
- 数字、模拟、混合信号IC和SOC设计技术
- IC计算机辅助设计技术、DFM
- 建模和仿真
- Track 3: 半导体器件和电路
- 无线系统的器件和电路
- 低功耗、射频器件和电路
- 硅/锗器件和器件物理
- 复合半导体器件和电路
- 非传统和纳米电子学
- 有机半导体器件和技术
- 光子学和光电子学
- Track 4: 工艺技术和制造
- 硅集成电路和制造
- 互连、低K、高K和其他工艺技术
- 封装和测试技术、设备技术
- 3D集成和先进封装
- Chiplet技术
- Track 5: 微机电系统（MEMS）和传感器
- THz和微波微系统
- 显示器、传感器和MEMS
- 能量收集和无线传感器
- 生物MEMS和生物医学传感器
- Track 6: 智能系统设计
- 软硬件协同设计
- AI数字、模拟软硬件优化
- 片上系统多目标优化
- GPU，TPU、DPU和专用AI加速器空间设计优化
- Track 7: 能源来源和储存
- 太阳能电池和其他新能源设备
- 先进的存储技术（Flash、FeRAM、PCM、ReRAM、MRAM等）
- 电池和能量储存系统
- Track 8: 应用和其他主题
- 通信ASIC和系统
- IC和系统设计中的人工智能和机器学习
- 量子计算和量子电子学
- Track 9: 集成电路的安全和安全的集成电路
- 硬件内在的安全原语（如PUF、TRNG、PQC/FHE/NTT）
- 架构和微架构攻击与防御
- 安全片上系统（SoC）架构
- 可信平台模块和硬件虚拟化
- 侧信道攻击及对策
- 消费电子系统和物联网硬件IP核的保护和信任
- AI/ML的安全和信任，以及AI/ML在硬件安全中的应用
- 硬件辅助的跨层安全
- 硬件安全应用中的新兴纳米级技术
