ICICM 2025-The 10th International Conference on
Integrated Circuits and
Microsystems
ICICM is an annual
conference, which aims to provide a platform for
researchers, engineers, academicians as well as
industrial professionals from all over the world
to present their research results and
development activities in Integrated Circuits
and Microsystems. ICs are now used in virtually
all electronic equipment and have revolutionized
the world of electronics. Computers, mobile
phones, and other digital home appliances are
now inextricable parts of the structure of
modern societies, made possible by the small
size and low cost of ICs. Integrated circuit
plays a vital role in electronic information
era, which now is becoming a first-class
discipline in China. In order to promote the
development of ICs, ICICM provides opportunities
for the delegates to exchange new ideas and
research findings face to face, to establish
business or research relations and to find
global partners for future collaboration.
The previous 9 editions ICICM have been successfully held in Chengdu
on November 23-25, 2016; in Nanjing on November
8-11, 2017; in Shanghai on November 24-26, 2018;
in Beijing on October 25-27,2019 and in Nanjing
on October 23-25, 2020 and Oct 22-24, 2021, as
well as October 28-31 in 2022, Oct 20-23 in
2023, in Wuhan on Oct 25-27. On
the basis of success of the previous 9 year,
ICICM comes to its 10th edition, herewith, we
are proud to announce 2025
The 10th International Conference on Integrated
Circuits and Microsystems (ICICM 2025) will be
held in Heifei, China on October 17-19, 2025,
which is co-sponsored by
Anhui University, China; Southeast
University, China and University of Electronic
Science and Technology of China.
集成电路在电子信息时代起着至关重要的作用,现已成为中国一级学科。顺应时代的发展和按照习近平总书记重要指示精神-“核心技术、关键技术、国之重器必须立足于自身”,自2016年以来,电子科技大学微电子与固体电子学会,东南大学协办集成电路与微系统国际会议从成都出发,先后在南京,上海,北京,南京,西安,南京,武汉举行了前9届会议。在此前9届会议的基础之上,ICICM即将举办第十届,我们很荣幸宣布二零二
五年第十届集成电路与微系统国际会议将于2025年10月17-19日在中国合肥举行!ICICM2025将由
安徽大学,东南大学,电子科技大学联合主办,安徽大学承办。
集成电路技术正迎来新的发展契机,随着人工智能、物联网、5G通信和量子计算等新兴领域的快速发展,集成电路在多学科交叉和多领域协同中的应用潜力不断释放。在技术演进的浪潮中,先进制造工艺的突破、高性能系统设计的优化以及绿色低碳技术的融入,将为行业注入强大的发展动力。ICICM
2025不仅致力于汇聚全球顶尖学者和行业专家,共同探索这些前沿课题,更希望通过搭建国际化的学术交流平台,助力中国芯片技术迈向全球领先,为集成电路产业的可持续发展贡献智慧与力量。我们热忱欢迎全球学者踊跃投稿、积极参会,与我们携手共襄盛会,共同书写集成电路与微系统领域的崭新篇章!