2026 11th International Conference on Integrated Circuits and Microsystems(ICICM)

ICICM is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs. Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.

The previous 10 editions ICICM have been successfully held in Chengdu on November 23-25, 2016; in Nanjing on November 8-11, 2017; in Shanghai on November 24-26, 2018; in Beijing on October 25-27,2019 and in Nanjing on October 23-25, 2020 and October 22-24, 2021, as well as October 28-31 in 2022, October 20-23 in 2023, in Wuhan on October 25-27，ICICM celebrated its 10th anniversary in 2025 in Hefei during Oct 17-19. On the basis of success of the previous 10 year, ICICM comes to its 11th edition, herewith, we are proud to announce 2026 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026) will be held in Xi'an, China on October 16-18, 2026, which is co-sponsored by Xi'an Jiaotong University; Southeast University and University of Electronic Science and Technology of China and will be hosted by Xi'an Jiaotong University, China.

集成电路在电子信息时代起着至关重要的作用，现已成为中国一级学科。顺应时代的发展和按照习近平总书记重要指示精神-“核心技术、关键技术、国之重器必须立足于自身”，自2016年以来，电子科技大学微电子与固体电子学会,东南大学协办集成电路与微系统国际会议从成都出发，先后在南京，上海，北京，南京，西安，南京，武汉, 合肥举行了前10届会议。在此前10届会议的基础之上，ICICM即将举办第十一届，我们很荣幸宣布二零二六年第十一届集成电路与微系统国际会议将于2026年10月16-18日在中国西安举行！ICICM2026将由西安交通大学，东南大学，电子科技大学联合主办，西安交通大学承办。

集成电路技术正迎来新的发展契机，随着人工智能、物联网、5G通信和量子计算等新兴领域的快速发展，集成电路在多学科交叉和多领域协同中的应用潜力不断释放。在技术演进的浪潮中，先进制造工艺的突破、高性能系统设计的优化以及绿色低碳技术的融入，将为行业注入强大的发展动力。ICICM 2026不仅致力于汇聚全球顶尖学者和行业专家，共同探索这些前沿课题，更希望通过搭建国际化的学术交流平台，助力中国芯片技术迈向全球领先，为集成电路产业的可持续发展贡献智慧与力量。我们热忱欢迎全球学者踊跃投稿、积极参会，与我们携手共襄盛会，共同书写集成电路与微系统领域的崭新篇章！

Proceedings

Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the conference proceedings, included in Digital Xplore.

ICICM2016-2025 (previous 10 years) have been successfully indexed by EI Compendex and Scopus already!

Journal Recommendation

Selected papers of ICICM2026 will be recommended to prepare extended version of paper to JOURNAL OF ELECTRONICS & INFORMATION TECHNOLOGY.
Monthly Journal Founded in 1979, The Source Journal of EI Compendex, The Source Journal of ESCI Database
Competent unit: Authorized by CAS, Host unit: Hosted by AIRCAS (IECAS), Department of Information Science of NNSFC
ISSN 1009-5896 | CN 11-4494/TN

Submission

Please log in the Electronic Submission System and upload your paper.
Should you have any questions about the submission, please contact us at: icicm_conf@vip.163.com
a. Full Paper with at least 4 full pages (Presentation and Publication)
b. Abstract within 300-500 words (Presentation only)

Important Dates

Conference Schedule

Conference Support

Co-Sponsored by

---

Hosted by

---

Patrons

---

Media Support