Working Time: 9:30-18:00
2025 The 10th International Conference on Integrated Circuits and Microsystems
    Email: icicm_conf@vip.163.com
    Secretary: Ms. Mila Xiao(肖老师)

 

ICICM 2025-The 10th International Conference on Integrated Circuits and Microsystems

ICICM is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs. Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.

The previous 9 editions ICICM have been successfully held in Chengdu on November 23-25, 2016; in Nanjing on November 8-11, 2017; in Shanghai on November 24-26, 2018; in Beijing on October 25-27,2019 and in Nanjing on October 23-25, 2020 and Oct 22-24, 2021, as well as October 28-31 in 2022, Oct 20-23 in 2023, in Wuhan on Oct 25-27. On the basis of success of the previous 9 year, ICICM comes to its 10th edition, herewith, we are proud to announce 2025 The 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025) will be held in Heifei, China on October 17-19, 2025, which is co-sponsored by Anhui University, China; Southeast University, China and University of Electronic Science and Technology of China.

集成电路在电子信息时代起着至关重要的作用,现已成为中国一级学科。顺应时代的发展和按照习近平总书记重要指示精神-“核心技术、关键技术、国之重器必须立足于自身”,自2016年以来,电子科技大学微电子与固体电子学会,东南大学协办集成电路与微系统国际会议从成都出发,先后在南京,上海,北京,南京,西安,南京,武汉举行了前9届会议。在此前9届会议的基础之上,ICICM即将举办第十届,我们很荣幸宣布二零二 五年第十届集成电路与微系统国际会议将于2025年10月17-19日在中国合肥举行!ICICM2025将由 安徽大学,东南大学,电子科技大学联合主办,安徽大学承办

集成电路技术正迎来新的发展契机,随着人工智能、物联网、5G通信和量子计算等新兴领域的快速发展,集成电路在多学科交叉和多领域协同中的应用潜力不断释放。在技术演进的浪潮中,先进制造工艺的突破、高性能系统设计的优化以及绿色低碳技术的融入,将为行业注入强大的发展动力。ICICM 2025不仅致力于汇聚全球顶尖学者和行业专家,共同探索这些前沿课题,更希望通过搭建国际化的学术交流平台,助力中国芯片技术迈向全球领先,为集成电路产业的可持续发展贡献智慧与力量。我们热忱欢迎全球学者踊跃投稿、积极参会,与我们携手共襄盛会,共同书写集成电路与微系统领域的崭新篇章!




Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the conference proceedings, and indexed by EI Compendex and Scopus, etc.

ICICM2016-2023 have been successfully indexed by EI Compendex and Scopus already!
ICICM2024 has been listed in IEEE Offcial Event List. (Click)
 

Template Download CFP flyer(En) 中文征稿通知

Selected papers of ICICM2025 will be recommended to prepare extended version of paper to JOURNAL OF ELECTRONICS & INFORMATION TECHNOLOGY.
Monthly Journal Founded in 1979, The Source Journal of EI Compendex, The Source Journal of ESCI Database
Competent unit:Authorized by CAS, Host unit:Hosted by AIRCAS (IECAS), Department of Information Science of NNSFC
ISSN 1009-5896 | CN 11-4494/TN

 

Submission

Please log in the Electronic Submission System and upload your paper.
Should you have any questions about the submission, please contact us at: icicm_conf@vip.163.com
a. Full Paper with at least 4 full pages (Presentation and Publication)
b. Abstract within 300-500words (Presentation only)

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Important Dates

Submission Deadline: April 1, 2025
NotificationDeadline: April 30, 2025
Registration Deadline: May 15, 2025
Camera Ready: October 1, 2025
Listener Registration: October 10, 2025
 

Oct 17, 2025

Onsite Sign-up  
workshop  
Committee Meeting  

Note

Only Listener can register onsite.

Listener (onsite reg.) appoinment

Oct 18, 2025

Opening Remarks
Keynote Speeches
Panel Session 1
Parallel & Poster Sessions
Dinner
 

Oct 19, 2025

Invited Speeches
Panel Session 2
Parallel Sessions
Dinner and Awards
 

Note

The detailed and confirmed conference program will come out around Sept. 20th. The temporary program at a glance is just for your reference.



           
           
           

 Conference Support  会议支持单位

     

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