Track 4: RF, Microwave & THz ICs for 6G

This track focuses on the circuit design and application of RF, Microwave and THz ICs, closely catering to the core technical requirements of 6G research and development. Centering on "system-module co-optimization", it covers system-level circuits such as 6G phased array transceivers and satellite communication circuits, as well as innovative designs and engineering applications of core modules including LNAs, PAs, mixers, filters and THz radiators. Its primary goal is to build an academic and industrial exchange platform for integrating cutting-edge achievements. Aiming at the gap that existing research mostly focuses on single modules or scenarios, the forum integrates full-dimensional studies of "system-level solutions, module-level innovation and engineering implementation", providing comprehensive technical references for the development of 6G RF, Microwave & THz IC field.

本论坛聚焦于射频、微波及太赫兹集成电路（IC）的电路设计与应用，紧密围绕 6G 研发的核心技术需求。论坛以“系统-模块协同优化”为中心，涵盖了 6G 相控阵收发器和卫星通信电路等系统级电路，以及包括低噪声放大器（LNA）、功率放大器（PA）、混频器、滤波器和太赫兹辐射源在内的核心模块的创新设计与工程应用。其主要目标是构建一个整合前沿成果的学术与产业交流平台。针对现有研究多集中于单一模块或场景的空白，本论坛整合了“系统级解决方案、模块级创新和工程实现”的全维度研究，为 6G 射频、微波和太赫兹集成电路领域的发展提供全面的技术参考。