Track 23: Agile Chip Innovation: LLM-Driven IC Design Automation Forum

English: With the rapid advancement of large language models, integrated circuit design automation is experiencing a paradigm shift. Centered on "Agile Chip Innovation," this forum focuses on frontier LLM-driven EDA technologies, exploring the profound applications of artificial intelligence in IC frontend architecture generation, physical design automation, analog circuit synthesis, and advanced heterogeneous integration. The forum aims to break the bottlenecks of prolonged design cycles and high iteration costs in traditional methodologies. By uniting leading experts from academia and industry, the event analyzes how intelligent assistance paradigms reshape the system-level co-design flow, enhance development agility and reliability, and drive the evolutionary leap of next-generation micro-nano electronic design automation.

中文: 随着大模型技术的飞速发展，集成电路设计自动化正迎来范式重构。本论坛以"敏捷创芯"为核心，聚焦大模型驱动的EDA前沿技术，探讨人工智能在集成电路前端架构生成、物理设计自动化、模拟电路综合以及先进异质集成中的深度应用。论坛致力于突破传统芯片设计周期长、迭代成本高的瓶颈，汇聚学术界与产业界前沿力量，共同剖析智能辅助研发范式如何重塑系统级芯片协同设计流程，提升芯片开发的敏捷性与可靠性，推动下一代微纳电子设计自动化技术的跨越式演进。