Track 22: Heterogeneous Integration & Interconnect Reliability

English: With the rapid development of artificial intelligence, high-performance computing, and advanced semiconductor systems, heterogeneous integration has emerged as a critical technology pathway to overcome the scaling limitations of traditional semiconductor technologies and enable high-performance system-level integration. In advanced electronic packaging, key technologies including high-density interconnects, micro-bumps, copper interconnects, hybrid bonding, and emerging interconnect materials play a crucial role in determining the performance, reliability, and lifetime of integrated systems. This special session focuses on interconnect technologies and reliability challenges in heterogeneous integration. It aims to bring together researchers from academia and industry to exchange the latest advances in advanced interconnect materials, interface engineering, failure mechanisms, reliability assessment methodologies, and emerging packaging processes. The session will provide a platform to discuss future trends and challenges in next-generation electronic packaging and integrated microsystems.

中文: 随着人工智能、高性能计算和先进半导体系统的发展，异构集成已成为突破传统芯片微缩瓶颈、实现高性能系统级集成的重要技术路径。先进封装中的高密度互连、微凸点、铜互连、混合键合及新型互连材料等关键技术，直接影响芯片系统的性能、可靠性与服役寿命。本分论坛聚焦异构集成背景下互连技术与可靠性问题，旨在汇聚学术界和产业界专家，交流先进互连材料、界面调控、失效机理、可靠性评价方法及新型封装工艺等方面的最新进展，探讨下一代电子封装与集成微系统的发展方向。