Working Time: 9:30-18:00
2025 The 10th International Conference on Integrated Circuits and Microsystems
    Email: icicm_conf@vip.163.com
    Secretary: Ms. Mila Xiao(肖老师)

 
  Technical Committtee Members
  Aili Wang, Zhejiang University, China
Bing Yuan, Xidian University, China
Bo Zhou, Beijing Institute of Technology, China
Changchun Zhang, Nanjing University of Posts and Telecommunications,China
Changlin Chen, National University of Defense Technology, China
Chao Zhao, CETC Nanjing Meichen Microelectronics, China
Cheng Liu,Shanghai University,China
Chenggang Yan, Nanjing University of Aeronautics and Astronautics, China
Chengying Chen, Xiamen University of Technology, China
Chunbing Guo, Guangdong University of Technology, China
Daming Yang, Peking University, China
Dongrong Zhang,Zhongguancun Laboratory,China
Feijun Zheng, Zhejiang University, China
Feng He, Beijing Institute of Smart Energy, Huairou Laboratory, China
Gengzhen Qi,Sun Yat-sen University,China
Hai-peng ZHANG, Hangzhou Dianzi University,China
Hanbo Jia, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
Helun Song, Suzhou Institute of Nano-Tech and Nano-Bionics, China
Huiyun Li, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,China
Jiafei Yao, Nanjing University of Posts and Telecommunications, China
Jian Guo, Southeast University, China
Jianwei Liu, National Key Laboratory of Integrated Circuits and Microsystems, Chongqing, China;The 24th Research Institute of China Electronics Technology Group Corp, Chongqing, China;
Junfeng Qu, Clayton State University, USA
Junqi Huang, Xiamen University of Technology, China
Kui Dang, Xidian University, China
Lei Chen, Beijing Microelectronics Technology Institute, China
Liji Wu, Tsinghua University,China
Liu weihong, Xi’an University of Posts and Telecommunications, China
Liu Xi-feng, Jiangsu Vocational College of Information Technology, China
Maliang Liu, Xidian University, China
Mei Jiang, Shenzhen University, China
Meng Meng, China Aerospace Component Engineering Center, China
Miao Cui, Xi'an Jiaotong-Liverpool University, China
Min Tian, Chongqing University, China
Min Yu, Peking University, China
Minming Huang, Sichuan University, China
Ningmei Yu, Xi'an University of Technology,China
Pengcheng Huang, National University of Defense Technology, China
Ping Ma, University of Science and Technology of China, China
Qi Li, Guilin University of Electronic Technology,China
Qingsheng Hu, Southeast University, China
Rui Jin, Beijing Institute of Smart Energy, Huairou Laboratory, China
Ruiguang Zhao, Northwvestern Poltechnical University, China
Shaozhen Zhang, Space Star Technology Co. Ltd., China
Shiwei Feng, Beijing University of Technology,China
Shuangming Yu, Chinese Academy of Sciences, China
Shujuan Mao, Beijing Superstring Academy of Memory Technology, China
Tao Su, Sun Yat-Sen University, China
Tao Wu, ShanghaiTech University, Shanghai, China
Tao Yin, Chinese Academy of Sciences, China
Tiehu Li, Chongqing University of Technology, China;Xidian University Chongqing Integrated Circuits Innovation Institute, Chongqing, China;
TieZhen Jiang, Anhui university, China
Tongqiang Liu, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China
Tuo Li, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China
Wen Cheng Lai, National Taiwan University of Science and Technology, China
Wengao Lu, Peking University, China
Xin Xin, Xi 'an University of Posts and Telecommunications, China
Xinbo Wen, Peking University Shenzhen Graduated School; TCL China Star Optoelectronic Co. Ltd., China
Xu Liu, Beijing University of Technology, China
Xuan Guo, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
Yang Zhao,Nanjing University of Science and Technology,China
Yaqi Ma, Soochow University, China
Yi Liu, Nanjing University of Posts and Telecommunications, China
Yongzheng Zhan, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China
Youming Zhang, Southeast University, China
Yun Wang, Guangdong Greater Bay Area Institute of Integrated Circuit and System, China
Zhang Jun, Nanjing University of Posts and Telecommunications, China
Zheng Yang, China Academy of Space Technology, China
Zhihong Huang, Chinese Academy of Sciences, China
Zhiwei Xu,Zhejiang University,China
Zhiyong Xiong, Shanghai Tianma Microelectronics Company Limited, China
Zhongjie Guo, Xi' an University of Technology, China
Zixuan Wang, Nanjing University of Posts and Telecommunications, China
Ziyue Zhang, Beijing Institute of Technology, China
Zongguang Yu, No.58 Research Institute, China Electronic Technology Group Corporation,China
Zongming Duan, East China Research Institute of Electronic Engineering, China