Working Time: 9:30-18:00
2024 The 9th International Conference on Integrated Circuits and Microsystems
    Email: icicm_conf@vip.163.com

 
  Technical Committtee Members
   Aili Wang, Zhejiang University, China
 Bing Yuan, Xidian University, China
 Changchun Zhang, Nanjing University of Posts and Telecommunications,China
 Changlin Chen, National University of Defense Technology, China
 Chao Zhao, CETC Nanjing Meichen Microelectronics, China
 Cheng Liu,Shanghai University,China
 Chengying Chen, Xiamen University of Technology, China
 Dongrong Zhang,Zhongguancun Laboratory,China
 Feng He, Beijing Institute of Smart Energy, Huairou Laboratory, China
 Gengzhen Qi,Sun Yat-sen University,China
 Hai-peng ZHANG, Hangzhou Dianzi University,China
 Hanbo Jia, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
 Helun Song, Suzhou Institute of Nano-Tech and Nano-Bionics, China
 Huiyun Li, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,China
 Jian Guo, Southeast University, China
 Junfeng Qu, Clayton State University, USA
 Junqi Huang, Xiamen University of Technology, China
 Liji Wu, Tsinghua University,China
 Liu weihong, Xi’an University of Posts and Telecommunications, China
 Liu Xi-feng, Jiangsu Vocational College of Information Technology, China
 Maliang Liu, Xidian University, China
 Meng Meng, China Aerospace Component Engineering Center, China
 Miao Cui, Xi'an Jiaotong-Liverpool University, China
 Minming Huang, Sichuan University, China
 Ningmei Yu, Xi'an University of Technology,China
 Pengcheng Huang, National University of Defense Technology, China
 Qi Li, Guilin University of Electronic Technology,China
 Qingsheng Hu, Southeast University, China
 Rui Jin, Beijing Institute of Smart Energy, Huairou Laboratory, China
 Ruiguang Zhao, Northwvestern Poltechnical University, China
 Shiwei Feng, Beijing University of Technology,China
 Shuangming Yu, Chinese Academy of Sciences, China
 Shujuan Mao, Beijing Superstring Academy of Memory Technology, China
 Tao Su, Sun Yat-Sen University, China
 Tao Wu, ShanghaiTech University, Shanghai, China
 Tao Yin, Chinese Academy of Sciences, China
 Tongqiang Liu, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China
 Tuo Li, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China
 Wen Cheng Lai, National Taiwan University of Science and Technology, China
 Wengao Lu, Peking University, China
 Xin Xin, Xi 'an University of Posts and Telecommunications, China
 Xinbo Wen, Peking University Shenzhen Graduated School; TCL China Star Optoelectronic Co. Ltd., China
 Xuan Guo, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
 Yang Zhao,Nanjing University of Science and Technology,China
 Yaqi Ma, Soochow University, China
 Yongzheng Zhan, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China
 Youming Zhang, Southeast University, China
 Yun Wang, Guangdong Greater Bay Area Institute of Integrated Circuit and System, China
 Zheng Yang, China Academy of Space Technology, China
 Zhihong Huang, Chinese Academy of Sciences, China
 Zhiwei Xu,Zhejiang University,China
 Zhiyong Xiong, Shanghai Tianma Microelectronics Company Limited, China
 Zhongjie Guo, Xi' an University of Technology, China
 Zixuan Wang, Nanjing University of Posts and Telecommunications, China
 Zongguang Yu, No.58 Research Institute, China Electronic Technology Group Corporation,China
 Zongming Duan, East China Research Institute of Electronic Engineering, China