Working Time:
9:30-18:00
2024 The 9th International Conference on Integrated Circuits and Microsystems
| Technical Committtee Members | |
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Aili Wang, Zhejiang University, China Bing Yuan, Xidian University, China Bo Zhou, Beijing Institute of Technology, China Changchun Zhang, Nanjing University of Posts and Telecommunications,China Changlin Chen, National University of Defense Technology, China Chao Zhao, CETC Nanjing Meichen Microelectronics, China Cheng Liu,Shanghai University,China Chenggang Yan, Nanjing University of Aeronautics and Astronautics, China Chengying Chen, Xiamen University of Technology, China Chunbing Guo, Guangdong University of Technology, China Daming Yang, Peking University, China Dongrong Zhang,Zhongguancun Laboratory,China Feijun Zheng, Zhejiang University, China Feng He, Beijing Institute of Smart Energy, Huairou Laboratory, China Gengzhen Qi,Sun Yat-sen University,China Hai-peng ZHANG, Hangzhou Dianzi University,China Hanbo Jia, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China Helun Song, Suzhou Institute of Nano-Tech and Nano-Bionics, China Huiyun Li, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,China Jiafei Yao, Nanjing University of Posts and Telecommunications, China Jian Guo, Southeast University, China Jianwei Liu, National Key Laboratory of Integrated Circuits and Microsystems, Chongqing, China;The 24th Research Institute of China Electronics Technology Group Corp, Chongqing, China; Junfeng Qu, Clayton State University, USA Junqi Huang, Xiamen University of Technology, China Kui Dang, Xidian University, China Lei Chen, Beijing Microelectronics Technology Institute, China Liji Wu, Tsinghua University,China Liu weihong, Xi’an University of Posts and Telecommunications, China Liu Xi-feng, Jiangsu Vocational College of Information Technology, China Maliang Liu, Xidian University, China Mei Jiang, Shenzhen University, China Meng Meng, China Aerospace Component Engineering Center, China Miao Cui, Xi'an Jiaotong-Liverpool University, China Min Tian, Chongqing University, China Min Yu, Peking University, China Minming Huang, Sichuan University, China Ningmei Yu, Xi'an University of Technology,China Pengcheng Huang, National University of Defense Technology, China Ping Ma, University of Science and Technology of China, China Qi Li, Guilin University of Electronic Technology,China Qingsheng Hu, Southeast University, China Rui Jin, Beijing Institute of Smart Energy, Huairou Laboratory, China Ruiguang Zhao, Northwvestern Poltechnical University, China Shaozhen Zhang, Space Star Technology Co. Ltd., China Shiwei Feng, Beijing University of Technology,China Shuangming Yu, Chinese Academy of Sciences, China Shujuan Mao, Beijing Superstring Academy of Memory Technology, China Tao Su, Sun Yat-Sen University, China Tao Wu, ShanghaiTech University, Shanghai, China Tao Yin, Chinese Academy of Sciences, China Tiehu Li, Chongqing University of Technology, China;Xidian University Chongqing Integrated Circuits Innovation Institute, Chongqing, China; TieZhen Jiang, Anhui university, China Tongqiang Liu, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China Tuo Li, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China Wen Cheng Lai, National Taiwan University of Science and Technology, China Wengao Lu, Peking University, China Xin Xin, Xi 'an University of Posts and Telecommunications, China Xinbo Wen, Peking University Shenzhen Graduated School; TCL China Star Optoelectronic Co. Ltd., China Xu Liu, Beijing University of Technology, China Xuan Guo, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China Yang Zhao,Nanjing University of Science and Technology,China Yaqi Ma, Soochow University, China Yi Liu, Nanjing University of Posts and Telecommunications, China Yongzheng Zhan, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China Youming Zhang, Southeast University, China Yun Wang, Guangdong Greater Bay Area Institute of Integrated Circuit and System, China Zhang Jun, Nanjing University of Posts and Telecommunications, China Zheng Yang, China Academy of Space Technology, China Zhihong Huang, Chinese Academy of Sciences, China Zhiwei Xu,Zhejiang University,China Zhiyong Xiong, Shanghai Tianma Microelectronics Company Limited, China Zhongjie Guo, Xi' an University of Technology, China Zixuan Wang, Nanjing University of Posts and Telecommunications, China Ziyue Zhang, Beijing Institute of Technology, China Zongguang Yu, No.58 Research Institute, China Electronic Technology Group Corporation,China Zongming Duan, East China Research Institute of Electronic Engineering, China |
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