Topics (related to the below topics, but not only limited)
Track 1: Integrated Circuits and Systems Design • Digital, Analog, Mixed Signal IC and SOC design technology • IC Computer-Aided –Design technology, DFM • Modeling and simulation Track 2: Semiconductor Devices and Circuits • Devices and Circuits for Wireless Systems • Low-power, RF devices & circuits • Silicon/germanium devices and device physics • Compound semiconductor devices and circuits • Unconventional and nano-electronics • Organic semiconductor devices and technologies • Photonics and optoelectronics Track 3: Process Technologies and Manufacturing • Silicon integrated circuits and manufacturing • Interconnect, Low K, High K and other process technologies • Equipment technology • 3D integration and advanced packaging Track 4: MEMS and Sensors • Thz and Microwave MicroSystem • Displays, sensors, and MEMS • Energy harvesting and wireless sensors • BioMEMS and biomedical sensors Track 5: Energy Sources and Storage • Solar cell & other devices for new energy sources • Advance memories technology (Flash, FeRAM, PCM, ReRAM, MRAM, etc.) • Batteries and energy storage systems Track 6: Applications and Other Topics • Communications ASIC and system • Packaging and testing technology • Reliability • AI and machine learning in IC and system design • Quantum computing and quantum electronics Track 7: EDA •Advancements in EDA Algorithms •EDA for Emerging Technologies •Hardware-Software Co-design with EDA •EDA in High-Performance Computing (HPC) •EDA for Analog and Mixed-Signal Design •Security and Reliability in EDA •Open Source EDA Initiatives •EDA and Internet of Things (IoT) •EDA for FPGA and ASIC Design •EDA in the Automotive Industry   Track 8: Intelligent System Design Hardware software co-design Software/hardare co-design for AI digital and ananog circuit design Multi-Objective optimisation for SoC design space optimisation for GPU, TPU, DPU and customised AI accelerator design	Track 1: 集成电路和系统设计 • 数字、模拟、混合信号IC和SOC设计技术 • IC计算机辅助设计技术、DFM • 建模和仿真 Track 2: 半导体器件和电路 • 无线系统的器件和电路 • 低功耗、射频器件和电路 • 硅/锗器件和器件物理 • 复合半导体器件和电路 • 非传统和纳米电子学 • 有机半导体器件和技术 • 光子学和光电子学 Track 3: 工艺技术和制造 • 硅集成电路和制造 • 互连、低K、高K和其他工艺技术 • 设备技术 • 3D集成和先进封装 Track 4: 微机电系统（MEMS）和传感器 • THz和微波微系统 • 显示器、传感器和MEMS • 能量收集和无线传感器 • 生物MEMS和生物医学传感器 Track 5: 能源来源和储存 • 太阳能电池和其他新能源设备 • 先进的存储技术（Flash、FeRAM、PCM、ReRAM、MRAM等） • 电池和能量储存系统 Track 6: 应用和其他主题 • 通信ASIC和系统 • 封装和测试技术 • 可靠性 • IC和系统设计中的人工智能和机器学习 • 量子计算和量子电子学 Track 7: 电子设计自动化（EDA） • EDA算法的进展 • 适用于新兴技术的EDA • 与EDA的硬件-软件协同设计 • 高性能计算（HPC）中的EDA • 模拟和混合信号设计中的EDA • EDA中的安全性和可靠性 • 开源EDA倡议 • EDA和物联网（IoT） • 适用于FPGA和ASIC设计的EDA • 汽车行业中的EDA Track 8: 智能系统设计 • 软硬件协同设计 • AI数字、模拟软硬件优化 • 片上系统多目标优化 • GPU，TPU、DPU和专用AI加速器空间设计优化
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