ICICM-International Conference on Integrated Circuits and Microsystems

is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. This conference provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.
The previous 2 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016 and Nanjing on November 8-11, 2017. The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018) will be held on November 24-26, 2018 in Shanghai, China with the support from University of Electronic Science and Technology of China and Southeast University, China.

第三届集成电路与微系统国际会议将于2018年11月24-26日在上海召开!本次会议由电子科技大学微电子与固体电子学会,东南大学联合承办,欢迎广大专家学者踊跃投稿,积极参会! 我们正努力逐步地将ICICM打造成为知名大型国际会议,而前两届ICICM会议的成功举办也为我们今后的发展奠定了坚实的基础,并给予了我们坚定的信心。会议论文集将由IEEE出版, 并由CPCI, Ei Compendex 以及Scopus等大型数据库检索

About ICICM 2018

Proceedings 论文集

All accepted papers after proper presentation and registration will be collected in the conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference.

ISBN: 978-1-5386-3505-6
Click to check it in IEEE Xplore

ISBN: 978-1-5090-2813-9
Click to check it in IEEE Xplore


Keynote Speakers | 主讲嘉宾

Prof. Degang James Chen, IEEE Fellow,
Iowa State University,

Prof. Gene Eu Jan,
National Taipei University,

Prof. Fei Yuan
Ryerson University,

Prof. Zhi-Jian Xie,
North Carolina A&T State University,

Prof. Zou Zhuo
Fudan University,

Sponsored by 主办方

Assisted by 技术支持


Our Partners 媒体合作

Latest News 会议新闻

November 6, 2018
Welcome the 6 new members of technical committee join in ICICM.

September 6, 2018
The conference proceedings of ICICM 2017 are indexed by Ei Copendex and Scopus.
2017年会议论文集已经被Ei 和Scopus 检索。

September 4, 2018
Prof.Sheng-Lyang Jang, Prof.Xiangliang Jin, and Prof.Wanrong Zhang join in technical committee. 
張勝良教授, 金湘亮教授, 张万荣教授加入大会技术委员会。 

August 13, 2018
Welcome Prof. Jinwen Zhang joins in the technical committee.

July 25, 2018
Welcome Prof. Atsushi Kurokawa, Assoc. Prof. Lu Tang, Assoc. Prof. Chunyi Song, Prof. Zhiwei Xu, Kai Luo, and Assoc. Prof. Wensi Wang join in the technical committee.

July 11, 2018
The final round of call for papers starts today and will end on August 20.