Working Time: 9:30-18:00
2022 The 7th International Conference on Integrated Circuits and Microsystems
    Email: icicm_conf@vip.163.com
    Tel:(86)136-2777-7774

 
  Technical Committtee Members
  Bing Yuan, Xidian University, China
Changchun Zhang, Nanjing University of Posts and Telecommunications,China
Changlin Chen, National University of Defense Technology, China
Chao Zhao, CETC Nanjing Meichen Microelectronics, China
Chunming Zhang, Xi’an University of Posts and Telecommunications, China
Chunyi Song, Zhejiang University,China
Dawei Ding, Anhui University, China
Dejin Zhou, Fudan University, China
Dongrong Zhang,Zhongguancun Laboratory,China
Fanyi Meng, Tianjin University, China
Gengzhen Qi,Sun Yat-sen University,China
Hai-peng ZHANG, Hangzhou Dianzi University,China
Haizhi Song,University of Electronic Science and Technology of China,China
Hao Gao, Austria & Eindhoven University of Technology, The Netherland
Jihai Duan, Anhui University, China
Jun Hu,Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd,China
Jun’an Zhang, Chongqing University of Technology, China
Junyong Deng, Xi’an University of Posts and Telecommunications, China
Lang Zhou, State Key Laboratory of High-end Server & Storage Technology, China
Liang Li, Suzhou Vocational University, China
Lu Tang, southeast university,China
Lu Zhu, Sun Yat-sen University, China
Maliang Liu, Xidian University, China
Mei Jiang, Shenzhen University, China
Nan Chen, Northwestern Polytechnical University, China
Pakornkiat Sawetmethikul, Rajamangala University of Technology Thanyaburi Pathum Thani, Thailand
Qi Li, Guilin University of Electronic Technology,China
Qiao Shushan, University of Chinese Academy of Sciences, China
Rui Shan,Xi’an University of Posts & Telecommunications, China
Shang Delong, Institute of Microelectronics of The Chinese Academy of Sciences, China
Shengming Huang, Tianjin University of Technology,China
Shiguang Shang, Xi’an University of Posts and Telecommunications, China
Tingcun Wei, Northwestern Polytechnical University, China
Wei Hu, Northwestern Polytechnical University, China
Wei Ren, Xi’an University of Posts and Telecommunications, China
Weiguang Sheng, Shanghai Jiao Tong University, China
Weilin Xu, Guilin University of Electronic Technology, China
Weixin Gai,Peking University,China
Wen Cheng Lai, National Taiwan University of Science and Technology, China
Xiangjun Lu,Xiamen University of Technology,China
Xiangliang Jin, Hunan Normal University, China
Xiaojiang Yao,Nanjing University of Posts and Telecommunications,China
Xiaojin Li, East China Normal University, China
Xin Xin, Xi 'an University of Posts and Telecommunications, China
Xuemin Wei,Guilin University Of Electronic Technology,China
Yacong Zhang, Peking University, China
Yang Jong-Ryul, Yeungnam University, South Korea
Yi Zhang, Nanjing University of Posts and Telecommnications,China
Yongqian Du,Northwestern Polytechnical University,China
Youming Zhang, Southeast University, China
Yuchun Peng,Anhui University,China
Yulu Chen,No. 50 Research Institute of China Electronics Technology Group Corporation,China
Yun Wang, Guangdong Greater Bay Area Institute of Integrated Circuit and System, China
Zhaohao Wang, Beihang University,China
Zhenhai Chen, HeFei University of Technology,China
Zhijun Zhou, Southeast University, China
Zhiwei Xu,Zhejiang University,China
ZhiWei Zhang, Hangzhou Dianzi University, China
Zhongjie Guo, Xi’an University of Technology, China
Zongming Duan, East China Research Institute of Electronic Engineering, China