Call for papers

The conference is calling for papers from all over the world.

Conference Scope 征稿主题


Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technolog
Reliability
Displays, sensors and MEMS

Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

Proceedings论文集

 All accepted papers after proper presentation and registration will be collected in the conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, and Scopus after the conference.

Papers of ICICM 2016 can be checked in IEEE Xplore now. (Check)

ICICM 2016的论文集已入库IEEE Xplore, 可在线查看(点击查看)

Submission Methods 投稿方式

1. Please log in the EasyChair Submission System and upload your paper.
请登陆会议电子投稿系统,并根据提示上传您的稿件
2. Any questions about submission, please contact icicm@young.ac.cn 
如您有任何疑问, 请及时联系会务组

为避免您的稿件被当成垃圾邮件投递失败,如果您在投稿后2个工作日内没有收到会务组的确认,请及时电话联系我们

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