Call for papers

The conference is calling for papers from all over the world.

Conference Scope 征稿主题

Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Displays, sensors and MEMS

Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)


 All accepted papers after proper presentation and registration will be collected in the conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, and Scopus after the conference.

Papers of ICICM 2018 can be checked in IEEE Xplore now. (Check)

ICICM 2018的论文集已入库IEEE Xplore, 可在线查看

Submission Methods 投稿方式

1. Please log in the EasyChair Submission System and upload your paper.

2. Any questions about submission, please contact 
如您有任何疑问, 请及时联系会务组


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